Modeling of Transients on IC Supply Rails Caused by ESD During Operation

Abstract

Electrostatic discharge (ESD) gun stress during operation is especially critical if it perturbs the supply system of an integrated circuit (IC). This paper presents a modeling technique of a transfer network (TFN), which stands between the ESD gun and the functional core supply for the first time. The TFN models transients on the IC supply rails. It is built up of elements with physical meaning. Therefore, its parameters allow adaptation to different physical implementations. The TFN includes elements external to the IC and their parasitics as well as the IC package and on chip n- and p-wells. The modeling approach enables to assess ESD gun disturbances at an early design stage of the IC development process and to take preventive measures accordingly.