Abstract
The content of this paper is the modeling of the stress in the printed circuit board due to the cyclic thermal stress for its ecological recycling. Cyclic thermal stresses result in separation of copper conduction paths and plastic plates due to different longitudinal expansion. For separation, it was important to determine the minimum temperature of the cyclical changes to separate the conductive copper paths and the plastic. We use mathematical modeling tools to describe the course of temperature fields in the PCB during heating and reheating. We conducted some simulation experiments in the Pro/ENGINEER programming environment to know the waveforms and stresses of the PCBs during the cyclic loading cycle. From experiments conducted in the laboratory, we have verified that the process of temperature separation is feasible for designing an eco-friendly way of recycling PCBs.
Highlights
With the development of new technologies that facilitate both the acceleration and acceleration of our lives, the production of electronic products grows proportionately
We have focused on the ecological separation of copper conductive paths from printed circuit boards due to thermal stress because it is separation based on a physical phenomenon
That is why we focused on the ecological separation of copper conductive paths from printed circuit boards by cyclic stresses due to temperature
Summary
With the development of new technologies that facilitate both the acceleration and acceleration of our lives, the production of electronic products grows proportionately The basis of these products is mainly printed circuit boards. Just like the Internet that is becoming part of our lives, these electronic products are increasingly needed and desirable without which we cannot These products have a certain lifetime and, when they are finished, they accumulate in landfills or are partially recycled. ( on referred to as "the Act") is based on EU waste legislation 2002/96 / EC [1, 3] These laws lay down the conditions for the disposal of waste electrical and electronic equipment, its separate collection and disposal from 13 August 2005. We have focused on the ecological separation of copper conductive paths from printed circuit boards due to thermal stress because it is separation based on a physical phenomenon
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