Modeling of bonding piezoelectric stack using conductive adhesive with metal-coated polymer fillers

Abstract

Bonding piezoelectric stack (BPS) is a common type of piezoelectric stack actuator (PSA) with an adhesive bonding layer. The regular bonding layer in BPS is produced by the dielectric materials, which may lead to electric energy dissipation and thus decrease the displacement of BPS. The dissipation can be compensated by substituting the regular bonding with the conductive adhesive (CA) using the conductive fillers, say, the metal-coated polymer fillers. In order to verify the feasibility of using this new BPS for piezoelectric devices and model-based controller designs, this paper establishes a novel BPS model using CA with metal-coated polymer fillers. In this paper, a dielectric model and a Kelvin–Voigt model are used to describe BPS’s electric and mechanical behaviors using regular bonding. A brief particle-bonding model is used to switch the BPS model using the regular bonding to the model using CA with metal-coated polymer fillers. The theoretical simulation and the experiment results demonstrate that the model has more than 97% accuracy. The results indicate that the dynamic model can accurately predict the displacement of BPS when the CA is used in conjunction with metal-coated polymer fillers and other metal-coated fillers, which can be used to design large-scale piezoelectric devices.