Abstract
The sputtering of hexagonal boron nitride due to low energy xenon ion bombardments occurs in various applications including fabrication of cubic boron nitride and erosion of Hall thruster channel walls. At low ion energies, accurate experimental characterization of sputtering increases in difficulty due to the low yields involved. A molecular dynamics model is employed to simulate the sputtering process and to calculate sputter yields for ion energies ranging from 10 to 350 eV. The results are compared to experimental data and a semiempirical expression developed by Bohdansky [Nucl. Instrum. Methods Phys. Res. B 2, 587 (1984)] is found to adequately describe the simulation data. Surface temperature effects are also investigated, and the sputter yield at 850 K is approximately twice that at 423 K.
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