Abstract
As the semiconductor industry pushes towards ever decreasing device sizes, the need for an efficient yet accurate simulation method increases. We present a different approach to modeling ultra small semiconductor devices through the use of recursive scattering matrices. This approach is a completely quantum mechanical approach in three dimensions, yet does not suffer from excessive computation time or resources. While the transport in most small semiconductor devices is typically 2D in nature, with a 3D model we are capable of incorporating the interaction of the 3D modes in the contacts with the 2D modes in the active regions. We demonstrate this approach by presenting results for a short channel fully-depleted SOI (Silicon On Insulator) MOSFET. We present results using both hardwall potentials and self-consistent potentials as calculated through the use of an iterative Poisson solver.
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