Abstract
Lead-free solder joints are the most widely used interconnects in electronic packaging industries.Characterization of lead-free solder materials is essential to predict the performance and deformation behavior of joints under various loading conditions in practical applications. Hence, a significant portion of the studies in this field are concerned with the solder joints, each of which has a very small diameter, in sub-millimeter range. Although the solder balls have very small dimensions, most of the analyses considered them as a bulk material. However, with the decrease of ball dimensions, size effects might play a significant role in material response. As the specimen dimensions decrease, the number of grains becomes very small, and hence individual grain properties play a vital role on overall material response. Therefore, modeling from the grain structure and orientation point of view could be an effective and more accurate way to predict solder joint deformation behavior under loading.In this study, the effect of grain size and orientation of the solder material is investigated for predicting anisotropic behavior of solder joints under shear load. A simplified threedimensional model of beach-ball configuration solder joint was generated and simulated using ABAQUS finite element (FE) software. Experimentally obtained viscoplastic grain properties were assigned to the computational geometry to create material anisotropy. The effects of material anisotropy were studied for varying grain size specimens, as well as for specimens with varying grain orientation. Finally, a comparison was established between the simulation predictions and the experimental results obtained from shear test of SAC305 solder balls.
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