Fatigue Behavior of SAC-Bi and SAC305 Solder Joints With Aging

Abstract

Reliability of microelectronic assemblies is typically limited by the fatigue failure of one of the interconnected solder joints. The fatigue behavior of the lead-free solder joints doped with bismuth under different stress loading and aging conditions is not yet understood. This article investigates the effect of adding bismuth on the mechanical reliability of SAC alloys considering different loading and aging conditions. The fatigue behavior and shear strength of individual SAC305 (Sn–3.0Ag–0.5Cu) and SAC-Q (Sn–3.4Ag–0.5Cu–3.3Bi) solder joints are examined and compared. A unique experiment is designed to test the individual solder joints using a micromechanical testing system. The results show that the fatigue life and shear strength of SAC-Q with Bi are much higher than SAC305 regardless of the aging and stress conditions. It was also found that increasing stress amplitude leads to a decrease in the fatigue life for both alloys. The aging time has a negative effect on the fatigue life and shear strength of both alloys. The impact of aging on SAC-Q solder joints is significantly less than that for SAC305. Microstructure analysis shows a substantial amount of precipitates coarsening with aging for SAC305 compared with SAC-Q. Hysteresis loop analysis shows that increasing the cycling stress amplitude and aging time leads to an increase in the work per cycle and plastic strain. Common fatigue models, such as Morrow energy model and Coffin–Manson model, fail to predict the life considering the effect of aging; aging affects the constants of both models.