Abstract
Solder joints reliability is a determinant factor for the life of the electronic assemblies. In this study, the reliability of actual SAC305 solder joints is investigated using accelerated shear fatigue tests. The effect of aging time and stress amplitude are studied. Five levels of aging time at 100 °C and three levels of stress amplitudes are applied in the experiments. Two-parameters Weibull distribution is used to describe the fatigue life of the solder joints at each test condition. A numerical model for the solder joints reliability is developed as a function of stress amplitude and aging time. The hysteresis loops at different aging times and stress amplitudes are demonstrated. The relationships between the inelastic work, plastic strain, and fatigue life are identified by exploiting the Coffin-Manson and Morrow Energy models. The results indicate a reduction in fatigue life and an increase in inelastic work and plastic strain when the cyclic stress amplitude is increased. Increasing the aging time has a negative impact on the fatigue life of the solder joint. The Morrow Energy model significantly outperforms the Coffin-Manson model in describing the fatigue behavior of the solder joints regardless of the aging conditions. Finally, a general reliability model as a function of the inelastic work per cycle is introduced.
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