Modeling and simulation of asymmetric stripline for multichip module applications

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Modeling and simulation of interconnect materials has become critical to the success of high performance ULSI, packaging, and multilayer schemes for multichip modules. Computer simulation of the characteristic impedance Z (Ohms), capacitance C (pF), working frequency f (MHz) of Al asymmetric stripline filled with anodic Al oxide with dielectric constants 4 and 6.6 for multilayer schemes in a hybrid multichip module were conducted. A RLC-model of the frequency of Al transmission lines was successfully used. Using conformal mapping, the functional dependence of the characteristic impedance and working frequency on the capacitance of the Al stripline filled by anodic Al oxide can be determined. The results are valid for high frequencies. To evaluate this model and characterize its performance with high speed electrical multichip module design, a test cell using a multilayer interconnect structure Al/anodic al oxide on an Al substrate was developed.