Modeling and Analysis of Signal Integrity of High-Speed Interconnected Channel With Degraded Contact Surface

Abstract

High-speed interconnected channels, including printed circuit boards (PCBs) and high-speed connectors, are widely used in digital baseband communication systems. Connector degradation may lead to deterioration of the integrity of digital signals and is one of the major causes of low communication quality. In this work, the effect of electrical contact degradation on signal integrity was investigated using model analysis and experimental testing. A 3-D electromagnetic field model of a high-speed channel with a degraded contact surface was developed to evaluate transmission loss, signal reflection, and crosstalk. Using multiconductor transmission line theory and contact physics, a distributed parameter circuit model of a high-speed channel with a degraded contact surface was also developed. The electromagnetic field model results are in good agreement with those obtained from the distributed parameter circuit model. Both the electromagnetic field model and the circuit model results are validated using experimental tests. The results of this investigation provide a better understanding of the characteristics of signal transmission through a degraded contact surface in a high-speed channel and theoretical support for identifying failure features in fault diagnosis.