Abstract
Silver-plated electronic devices are extensively used in microwave circuits. The electrochemical migration of silver in these circuit boards can affect high-frequency characteristics and signal integrity. In this work, the effect of silver migration on signal transmission of printed circuit boards was evaluated using both experimental testing and analytic modeling. The S parameters of circuit boards with silver migration were measured. Based on multi-conductor transmission line theory and electrical properties of dendrite-like electrochemical migrated silver, a distributed parameter circuit model for the circuit board with silver migration was developed. The model results are in good agreement with those obtained from the experimental tests. The results of this investigation provide a better understanding of the high-frequency behavior of a circuit board with silver migration and theoretical support for identifying failure features in fault diagnosis.
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