Abstract
Based on the principle and technical characteristcs of point grinding process, the function of the side contact area of the thin CBN point-grinding wheel in material removal process is discussed, and the geometry and parameters models of the side contact area are established. Mathematic modeling and analysis are carried out for the side contact layer parameters, such as the equivalent workpiece diameter, the geometric and dynamic contact arc length, cutting depth of single abrasive grain and average cross-sectional area of chips. The grinding experiment is carried out to study the mechanism of effect of side contact layer parameters on the quick point grinding process and the wear characteristic and rule of thin CBN point-grinding wheel. It is found that the material removal is mainly completed in the side contact layer and the maximum wear rate of the thin CBN point-grinding wheel occurs at the largest circumference of wheel side in the point grinding process.
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