Abstract
This paper presents the results of a combined experimental and theoretical study of interfacial fracture in organic electronic structures. Interfacial fracture toughness is investigated as a function of mode mixity using Brazil disk specimens. The measured fracture toughness values are then compared with predictions determined from crack-tip shielding estimates and atomic force microscopy measurements of adhesion between layers that are relevant to organic electronic structures. The interfacial and layer fracture mechanics are elucidated before discussing the implications for the design of robust organic electronic structures.
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