Mode III fracture problem of an FGPM strip bonded to an FGPM half-plane with embedded arbitrarily oriented cracks

Abstract

This article studies the anti-plane crack problem of a functionally graded piezoelectric material (FGPM) cracked strip bonded to an FGPM-cracked half-plate. Each crack is arbitrarily oriented. The material properties are assumed to be exponential forms varied in the direction normal to the interface. Using Fourier transforms, the problem can be reduced to a system of singular integral equations, which are solved numerically by applying the Gauss–Chebyshev integration formula. Numerical calculations are carried out to obtain the crack driving forces, such as the stress intensity factors (K), energy density factors (S), and the energy release rates (G), at the crack tips. The influences of the non-homogeneous parameter, crack orientation, electrical displacement, and the crack length on the normalized factors and rates are graphically discussed.