Abstract
The GE Corporate Research and Development Center in Schenectady, NY, has developed an innovative multichip module (MCM) technology-high-density interconnect (HDI)-that provides a high performance solution to packaging and interconnection needs. To address commercial markets, a low-cost solution for MCMs has to be found. This paper presents an approach to reduce the IC pretest cost to a minimum in the absence of industry accepted known good die. The IC pretest method presented is based on the assumption that adequate testing is being performed by the component manufacturer and that a relevant subset of tests can screen for component defects occurring after wafer test. This approach differentiates between device complexities, their quantity, and function in the digital MCM. Using this methodology, in the absence of a fully developed KGD environment. IC pretest is a requirement for MCM prototype quantities and small production runs. Validation data for the test methodology is presented together with a discussion of the respective limitations and drawbacks. >
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