Abstract
A miniaturised 45° power divider using three-dimensional MMIC technology is described. The divider comprises stacked thin-film microstrip lines that sandwich a ground plane between them. It has an area of only 0.43 mm2, and it exhibits a coupling of 4.5 ± 0.2 dB and a phase difference of 45 ± 1° from 28 to 33 GHz.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Paper version not known
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
