Abstract
This paper highlights the key advantages of the three-dimensional (3-D) MMIC technology in the millimeter-wave frequency band and describes recently developed compact 3-D MMICs on GaAs and Si substrates. The 3-D MMIC technology offers high integration levels, compactness, simple design procedures, and short fabrication turn-around time, resulting in millimeter-wave MMICs at greatly reduced cost. This paper also proposes a new methodology for MMIC development based on 3-D/multilayer MMIC technology that accelerates the cost reduction of millimeter-wave MMICs. The new technology achieves compact and highly integrated millimeter-wave MMICs that are extremely cost effective.
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