Abstract

Mid-infrared (MIR) silicon photonics holds the potential for realizing next generation ultracompact spectroscopic systems for applications in gas sensing, defense, and medical diagnostics. The direct epitaxial growth of antimonide-based compound semiconductors on silicon provides a promising approach for extending the wavelength of silicon photonics to the longer infrared range. This paper reports on the fabrication of a high performance MIR photodetector directly grown onto silicon by molecular beam epitaxy. The device exhibited an extended cutoff wavelength at ∼5.5 μm and a dark current density of 1.4 × 10–2 A/cm2 under 100 mV reverse bias at 200 K. A responsivity of 0.88 A/W and a specific detectivity in the order of 1.5 × 1010 Jones was measured at 200 K under 100 mV reverse bias operation. These results were achieved through the development of an innovative structure which incorporates a type-II InAs/InAsSb superlattice-based barrier nBn photodetector grown on a GaSb-on-silicon buffer layer. The difficulties in growing GaSb directly on silicon were overcome using a novel growth procedure consisting of an efficient AlSb interfacial misfit array, a two-step growth temperature procedure and dislocation filters resulting in a low defect density, antiphase domain free GaSb epitaxial layer on silicon. This work demonstrates that complex superlattice-based MIR photodetectors can be directly integrated onto a Si platform, which provides a pathway toward the realization of new, high performance, large area focal plane arrays and mid-infrared integrated photonic circuits.

Highlights

  • Mid-infrared (MIR) photodetectors operating between 2 and 8 μm are of considerable technological importance for a wide range of applications including medical diagnostics, environmental monitoring, infrared imaging, and chemical sensing

  • It is possible to relieve the strain at the Si:III−V interface via the formation of a periodic array of 90° interfacial misfit dislocations (IMF), which propagate laterally rather than vertically to the horizontal plane.[14]

  • Following deposition of the AlSb, a two-step growth temperature method was employed for the epitaxial growth of a 2 μm thick GaSb buffer layer

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Summary

Introduction

Mid-infrared (MIR) photodetectors operating between 2 and 8 μm are of considerable technological importance for a wide range of applications including medical diagnostics, environmental monitoring, infrared imaging, and chemical sensing. Commercially available sensors and focal plane arrays (FPAs) are predominantly based on mercury− cadmium−telluride (MCT) materials These devices require cooling to cryogenic temperatures to avoid excessive dark currents and suffer from poor compositional uniformity resulting in low reproducibility yields and high fabrication costs.[1] Type II InAs/InAs1−xSbx superlattices (SLs) have emerged as a viable technology to compete with MCT.[2] The type-II band alignment in the system leads to spatial separation of electrons and holes, providing remarkable flexibility for band structure engineering which enables the bandgap to be tuned across a wide wavelength range from 3 to 11 μm.[3] It is possible to engineer the bandstructure to suppress intersub-band transitions to reduce nonradiative Auger recombination. The device demonstrated a midwavelength, 100 mV reverse bias specific detectivity in the order of 1010 Jones at 200 K

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