Abstract
Polystyrene–Mg2SiO4 ceramic composites have been prepared by kneading followed by hot pressing. The dielectric properties of the composites have been investigated at both radio and microwave frequency ranges as a function of filler loading up to 50 vol.%. The dielectric constant and loss tangent increased with the ceramic filler content. The composite with 50 vol.% filler had a dielectric constant of 4.0 and loss tangent of 0.006 at 5 GHz, with Vickers microhardness of 35 HV. The coefficient of thermal expansion of the composite decreased and the thermal conductivity increased with the filler loading. PS–Mg2SiO4 composites are possible candidates for microwave substrate applications.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
