Abstract
Hybrid integration of microwave and millimeter wave circuits is essential for achieving future communication objectives in radio systems. Hybrid integrated circuits are circuits which are manufactured on a single planar substrate. Passive elements are fabricated by partial metallization of the substrate; active devices are inserted by bonding semiconductor diodes or bulk devices to the metal conductors. We discuss the electrical properties of passive line elements on insulating substrates. We also compare the design formulas given with measurements made at 30 GHz, and present the results obtained at 30 GHz with wideband transitions from waveguide to microstrip and the measurements obtained with microstrip IMPATT oscillators and high order varactor multi-pliers in the same frequency range. There are advantages of scaling for building hybrid integrated circuits which we discuss. Oversize models can be built and tested in a relatively short time and substantial savings in turnaround time, required man-power, and cost can be achieved.
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