Abstract
Microstructures were formed on low temperature co-fired ceramic (LTCC) green substrates with high fidelity using micro embossing. The impact of embossing temperature and pattern density against the embossed profiles was investigated. The increase in pattern density resulted in a macro deformation in addition to embossed micro-depth. The macro deformation can be decreased by careful management of pattern density as well as pressure ramp and temperature ramp. The embossed ceramic green substrates were debinded and co-fired with a supplier-recommended process; the dimension shrinkage of embossed channels after co-firing ranges from 20 to 22% in depth and from 10 to 13% in width. The achievements of this investigation demonstrated that micro embossing is a promising process for fabricating ceramic-based microstructures and devices, including embedded cavities and channels.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
