Abstract
Copper alloy wires are regarded as essential for bonding in semiconductor packaging. However, the existing single-crystal copper wires are susceptible to oxidize, resulting in connection failure. And the current production process of multi-pass cold-drawing is complicated. In this study, nickel-aluminum-bronze (NAB) alloy wires by the melt-extracted method were investigated to avoid the problems mentioned above. The results showed that the microstructure of the copper alloy wire differs depending on the region. The nano-Ni3Al phase precipitates on the lath martensitic β' phase in the concave area, while the interior of the copper alloy wires contains a large number of reflection-twin of the β' phase. As the melt-extracted process continues, the cooling speed increases until the formation of the stable lamellar αw + β' structure. These results will shed new light on the formation mechanism of copper alloy bonding wires.
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