Abstract
The low silver copper alloy (LSCA) wires characterized by high electrical and high mechanical properties was prepared by in situ composite technology. In this work, the evolution of microstructure and properties of the LSCA from rod to wires were studied. The LSCA (Cu–1.0 wt%Ag)with the diameter of 30 mm was prepared and then solid solution treated at 800 °C for 4 h. Then, the ingot was rolled and drawn to wires with the diameter of 3.00 mm aged at 500 °C for 4 h. The microstructure of specimen in different states were investigated and the sequent conductivity and mechanical properties were also studied.
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