Abstract
In this study, the Cu/In–Sn–20Cu/Cu solder joints were fabricated under the bonding temperature of 260 °C, bonding stress of 3 MPa and bonding time of 0.5–60 min by transient liquid phase bonding. The influence of bonding time on the microstructure evolution and the shear strength of the solder joints was investigated. The results indicated that the intermetallic compound in the interface reaction zone was Cu3(In, Sn) phase, and its thickness was increased continuously with increasing bonding time. The scallop-type Cu6(In, Sn)5 phase was formed at the interface of Cu3(In, Sn)/In–Sn–20Cu composite solder and then gradually grew to connect the island-type Cu6(In, Sn)5 phase which formed in the in situ reaction zone. The transformation of Cu6(In, Sn)5 phase to Cu3(In, Sn) phase occurred in the in situ reaction zone after the bonding time reached 15 min. The shear strength of the Cu/In–Sn–20Cu/Cu solder joints was increased first and then decreased with increasing bonding time. The maximum shear strength was 26.54 MPa when the bonding time reached 15 min. The shear fracture mechanism of solder joints transited from brittle fracture to ductile–brittle mixed fracture with increasing bonding time.
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