Effects of In/Ce to Sn-3.5Ag Lead-Free Solder on Microstructures and Properties

Abstract

The Sn-3.5Ag based lead-free electronic solder doped with element In /Ce were prepared respectively using a smelting method with protection by molten salt (SMPMS). The effects of In addition and Ce addition on microstructure, melting point and wettability of Sn-3.5Ag solder were investigated comparatively. And the effects of addition on the intermetallic compound (IMC) layer formed at solder/Cu substrate interface and the shear strength of solder joint were also studied. The results showed that appropriate In or Ce addition can refine Ag3Sn grains and improve the shear strength of solder joint. Element In can significantly reduce the melting point, narrow the melting range of the solder alloy and improve wettability on Cu substrate. When the content of In was 3%, the spreading area was the largest and the wettability was the best. The addition of Ce can efficiently reduce the thickness of the IMC layer grown at the solder/Cu substrate interface and improve the shear strength of solder joint. When the content of Ce was 0.5%, the solder joint had the minimum average IMC thickness and the maximum shear strength.