Abstract
The effect of microstructure on the creep properties and the failure mechanism of SnAgCu solder joints was studied. Single overlap shear specimens made of FR-4 printed circuit boards (PCBs) with organic solderability preservative (OSP), NiAu, and immersion Sn surface finish were reflow-soldered with hypoeutectic, eutectic, and hypereutectic SnAgCu solder paste. Creep tests of the solder joints were performed at 85°C and 105°C under constant load. The effect of microstructure on the creep behavior of the joints was studied by examining the fracture surfaces and cross-sectional samples of the tested joints. Results show that the intermetallic compound at the interface between the PCB and solder affects the fracture behavior of SnAgCu solder joints, thus creating a significant difference in the creep properties of solder joints on different surface finishes. Composition of SnAgCu solder was also found to affect the creep properties of the joints.
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