Abstract
In this paper, we investigated the intermetallic compound (IMC) morphology of aged (0, 200, 600 h) conventional Sn-37Pb and Pb-free Sn-4Ag-0.5Cu solder joints/(Ni-P/Au) UBM; the creep properties of the solder joints were evaluated using a shear punch creep test (SPCT) method. The creep displacement-time curves of the solder joints exhibited different behaviors depending on stress application and aging treatment conditions. Empirical formulas such as the Power-law and Monkman-Grant relationship have been used to analyze the SPCT data. Furthermore, the IMC behavior of solder joints was investigated using energy-dispersive X-ray spectroscopy (EDS) and a scanning electron microscope (SEM). The result showed that with an increase of the aging time, the stress exponents (n) of solder joints were decreased, but the IMC thickness and size were increased. In most of the experimental conditions, the creep properties of Pb-free solder joints were superior to the conventional Sn-37Pb solder joints.
Highlights
Conventional Sn-Pb solder joints are commonly used as the most outstanding solder joint for the electronic packaging industry
In most of the experimental conditions, the creep properties of Pb-free solder joints were superior to the conventional Sn-37Pb solder joints
Conventional Sn-Pb solder alloys are treated as general waste and have bad effects on the environment, such as air and water pollution; they especially have a bad effect on human health [3]
Summary
Conventional Sn-Pb solder joints are commonly used as the most outstanding solder joint for the electronic packaging industry. The shear punch creep test method has been investigated by many interface of SAC solders/UBM have an influence on the pull strength of the joint [9]. Hand, the shear punch creep test method has been investigated by many researchers for over twenty As a result, this method is considered as an acceptable tool for determining material creep properties years, and it has been applied to evaluate the ductile and brittle materials. There have been few reports about applying this creep test method using the SPCT for considered as an acceptable tool for determining material creep properties [10]. The main purpose of this study is to assess and investigate the creep mechanical properties aged Pb-free Sn-4Ag-0.5Cu solder joints/(Ni-P/Au) UBM using the SPCT method at 30 °C.
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