Microstructure and thermal expansion properties of invar-type Cu-Zn-Al shape memory alloys

Abstract

The effects of grain size, volume fraction of the α (fcc) phase in the β (bcc) matrix, and thermal stability on low thermal expansion (LTE) properties of Cu-Zn-Al shape memory (SM) alloys induced by cold rolling were investigated by dilatometry, optical microscopy, differential scanning calorimetry, and electrical conductivity measurements. The alloys with the larger grains showed a superior two-way memory (TWM) effect, wider LTE temperature intervals with excellent thermal stability under 80°C. The α+β two-phase alloys also exhibited a good combination of cold workability and LTE properties. These results suggest that the Cu-Zn-Al alloys with high electrical conductivity of about 20% International Annealed Copper Standard (%IACS) have high potential as a new class of Invar alloys that can be applied in various fields.