Microstructure and properties of FeCoNiCrAl high-entropy alloy particle-reinforced Cu-matrix composites prepared via FSP

Abstract

Although copper has excellent thermal conductivity, poor wear resistance seriously limits its development. In this paper, a Cu matrix surface composite material reinforced by FeCoNiCrAl high-entropy alloy particles was prepared by friction stir processing. The microstructure and properties of the composite were investigated. The results showed that both the FSP process and the addition of HEA particles contributed to the refinement of the Cu-matrix grains. A diffusion layer with a width of about 0.8 µm was formed at the interface between the HEA particles and the Cu matrix. Compared with received Cu, the microhardness of Cu matrix in the composites was increased by 69.8%, the wear rate was reduced by 29.7%, and the wear resistance was significantly improved. Mean while, the ductility of the composite was consistent with that of the received Cu, and the thermal conductivity reached 87% of the received Cu. Therefore, this paper provided a new possibility for developing multifunctional structural materials with high wear resistance, high ductility, and high thermal conductivity.