Abstract
AbstractA clear understanding of the bonding process in the cofired tungsten-aluminum nitride (W-AIN) metallized system is not currently available. Therefore, in an attempt to obtain a fuller understanding of this process, reactions between metallic W, tungsten trioxide (WO3), and calcium tungstate (CaWO4) with aluminum nitride have been studied using a variety of electron microscopy techniques. The observed reaction was found to be similar in all cases, resulting in the formation of metallic tungsten particles within the AIN substrates. A reaction sequence is proposed to explain adhesion in the W-AIN metallized system; thermodynamic calculations support the proposed reaction sequence. The adhesion in this system is due to both a mechanical fastening by an interlocking and a chemical precipitation reaction. Finally thermal conductivity measurements across the interface have been made to assess the ability of the interface to transfer heat.
Published Version
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