Abstract
Cu-Ni-Sn alloys have attracted attention in the electronics and electrical industries for their good mechanical properties and resistance to stress relaxation. The effect of Equal Channel Angular Pressing (ECAP) on the microstructural and properties of a Cu-9.0Ni-1.0Sn-0.5Si-0.5Al alloy were systematically investigated by means of hardness tests, tensile tests, conductivity measurements and electron microscope observations. After 8 ECAPed passes, initial coarse grains were significantly refined, and the average grain size decreased to 0.5 μm. Grain refinement was related to the rotation of deformation twin and the movement of dislocations in the grains during ECAP processing, the strength increment of Cu-Ni-Sn-Si-Al alloy during ECAP was mainly attributed to the low-angle boundaries strengthening (σSGB). After aged at 400 °C for 300 min, the tensile strength, elongation and electrical conductivity of the 8 pass ECAPed sample were 976 MPa, 5% and 13.7% IACS, respectively. The spherical Ni3Al/Ni3Si and Ni3Sn precipitates with the size of about 6 nm formed in 8 pass ECAPed samples after aging. The orientation relationship (OR) between the Cu matrix and precipitates was [1̅1̅1]Cu//[1̅1̅1]p and [2̅00]Cu//[1̅00]p.
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