Abstract
Novel Bi–Sn–In–Ga–Zn powders were fabricated using a gas atomization process. The addition of 5.0wt% Zn to a Bi–Sn–In–Ga alloy system resulted in the formation of a pure Zn state as a precipitate, which was mostly dispersed along the grain boundaries during solidification. From this reason, the refined microstructure, which was effective for easy adsorption of outer thermal energy and high surface free energy, could provide a lower onset melting temperature of 58.9°C and narrower melting range of 6.9°C compared to those of the quaternary solder powders used as a reference (61.6 and 7.6°C, respectively). The hardness of the quinary solder was also significantly increased (by 34.7%) by the addition of Zn. As a result, the quinary solder pastes reflowed at a low melting temperature of 110°C, which is well suited to the formation of solder joints on a flexible polyethylene terephthalate (PET) substrate.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
