Abstract
Ternary Bi–Sn–In micropowders and nanoparticles were prepared as a composite solder material via a gas atomization process and a chemical reduction method, respectively. The nanoparticles, with a 71.1°C melting temperature, entered among the intervals of the higher melting temperature (79.4°C) micropowders, and then reflowed at 110°C on a flexible polyethylene terephthalate (PET) substrate. This considerably increased the thermal diffusivity of the nanoparticles to refine the surface morphology of the solder bumps. Their adhesion strength also increased from an average shear force of 0.33–0.43N by viscosity improvement, afforded to the reinforcement of 5.0wt.% added nanoparticles. However, the adhesion strength (0.25N average shear force) of the composite solder bumps deteriorated at 15.0wt.% added nanoparticles and resulted in a high electrical resistivity (72.53±8.54μΩcm) due to the formation of their surface-oxidized phases.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
