Abstract
The microstructural evolution in eutectic Sn-37Pb solder under high current density seriously threatens the reliability of solder interconnections, but atomic electromigration has often been confused with thermomigration. In this paper, after decoupling the effect of the non-uniform temperature distribution in a Cu/Sn-37Pb/Cu lap joint from the current stress, the microstructural evolution was investigated under an average current density of 1.84 × 104 A cm−2 for 0–24 h. The decomposition and recombination of the Pb-rich phase occurred at the cathode and the anode, respectively. The corresponding migration mechanism was proposed from the viewpoint of energy and was explained by the interactions among the potential energies of ripening, electron wind force, and back stress. Our study may be helpful for understanding the migration mechanism and reliability of eutectic two-phase solder joints and provides supporting data for interpreting the acceleration tests of Sn-37Pb solder joints under electromigration.
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