Abstract
The miniaturized 10 GHz microstrip band-pass filter was successfully fabricated on the alumina thick films grown on Cu substrates at room temperature by aerosol deposition method and using the newly developed pattern electroplating procedure and electromagnetic analysis. The relative dielectric permittivity and loss tangent of the aerosol-deposited alumina thick films on Cu were 9.9 and 0.089, respectively. The resistivity of the electroplated Cu line was determined to be 2 × 10− 8 Ω m. The very good agreement was shown between results simulated using a 3-dimensional electromagnetic analysis and the actual measured data.
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