Application of Al 2O 3-based polyimide composite thick films to integrated substrates using aerosol deposition method

Abstract

Al 2O 3-based polyimide composite thick films were successfully fabricated with reduction of residual stress and improvement in plasticity for integrated substrates at room temperature by aerosol deposition method. Scanning electron microscopy and energy dispersive spectroscopy mappings exhibited a high content of Al 2O 3 evenly distributed in the composite thick films. The relative dielectric permittivity and loss tangent of Al 2O 3-based polyimide composite thick films were 7.6 and 0.007, respectively. There was almost no change in the crystallite size of Al 2O 3-based polyimide composite thick films compared with that of starting powder due to the reduction of kinetic energy by polyimide during collision on the substrates. Moreover, it was confirmed that the residual stress of Al 2O 3-based polyimide composite thick films remarkably decreased compared with that of Al 2O 3 thick films.