Abstract
Holographic-like three-dimensional (3D) acoustic imaging is developed for micro-nondestructive evaluation of microelectronics. It is implemented by stacking all the interface slices together to locate and identify hidden defects. Matching pursuit based acoustic time-frequency domain imaging is proposed to overcome the wavelength limit of axial resolution so that ultra-thin slices are generated. Experiments are performed on 3D acoustic data collected from microelectronic packages. Results show that the proposed technique resolves closely spaced features that are unavailable by conventional acoustic imaging, revealing more image details of defects.
Published Version
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