Micromechanisms of brittle fracture: STM, TEM and electron channeling analysis. Final report

Abstract

The original thrust of this grant was to apply newly developed techniques in scanning tunneling and transmission electron microscopy to elucidate the mechanism of brittle fracture. This grant spun-off several new directions in that some of the findings on bulk structural materials could be utilized on thin films or intermetallic single crystals. Modeling and material evaluation efforts in this grant are represented in a figure. Out of this grant evolved the field the author has designated as Contact Fracture Mechanics. By appropriate modeling of stress and strain distribution fields around normal indentations or scratch tracks, various measures of thin film fracture or decohesion and brittle fracture of low ductility intermetallics is possible. These measures of fracture resistance in small volumes are still evolving and as such no standard technique or analysis has been uniformly accepted. For brittle ceramics and ceramic films, there are a number of acceptable analyses such as those published by Lawn, Evans and Hutchinson. For more dissipative systems involving metallic or polymeric films and/or substrates, there is still much to be accomplished as can be surmised from some of the findings in the present grant. In Section 2 the author reviews the funding history and accomplishments associated mostly with bulk brittle fracture. This is followed by Section 3 which covers more recent work on using novel techniques to evaluate fracture in low ductility single crystals or thin films using micromechanical probes. Basically Section 3 outlines how the recent work fits in with the goals of defining contact fracture mechanics and gives an overview of how the several examples in Section 4 (the Appendices) fit into this framework.