Abstract
Silicon fusion bonding is studied as an enabling technology for the fabrication of microrobotic mechanisms. The effects of both surface activation technique and annealing temperature on bond strength are considered using a crack-opening technique. As part of the study, the relationship between patterned silicon feature size and the resulting bond strength is explored. Based on the experimental results, recommendations for an optimal silicon fusion bonding process for micromechanism fabrication are presented. The experimental results indicate that bulk silicon bonding strength can be achieved independent of feature size at temperatures as low as 300°C, with positive implications for micromechanism fabrication.
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