Abstract
This paper demonstrates a low-cost process for fused silica micro shell resonators with quartz glass mold by thermal reflow under negative pressure. Wafer-level fused silica shell resonators with reduced size are prepared using this process. The results show that the fabricated resonator has a diameter of 2.7 mm with a Q-factor of 306k for n=2 wine-glass mode frequency at 63.698 kHz. The volume is reduced by at least 4 times compared to reported fused silica resonators. This work provides the potential for the preparation of sub-millimeter or even micron-fused silica shell resonators.
Full Text
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call