Microencapsulation of 1-methylimidazole using solid epoxy resin: study on microcapsule residence time and properties of the system

Abstract

In this study for the first time 1-methylimidazole was microencapsulated successfully by solid epoxy resin using solvent evaporation method. Fourier transform infrared spectroscopy, scanning electron microscopy, thermal gravimetric and differential scanning calorimetry were used for characterization of microcapsule and epoxy resin/microcapsule systems. The results revealed that although the solid epoxy shell was in contact with imidazole curing agent for a long time, it still remained as a thermoplastic. The chain length of the solid epoxy resin was grown in anionic polymerization process which led to an increase in the melting temperature from 64 to 78 °C. On the other hand, all epoxy functional groups of the shell did not participate in the curing reaction of resin with core curing agent of the microcapsule. The results showed that by increasing the residence time of the microcapsules, the number of epoxy groups of liquid epoxy decreased slightly but the rate of complex viscosity increase or the rate of curing reaction was increased and the cured epoxy system exhibited a single-phase morphology. On the other hand, in the presence of microcapsules the curing reaction of epoxy resin was successfully carried out and the curing temperature and the onset of viscosity increase or gel time at 120 °C were not more or less affected by sufficiently long contact time of epoxy and microcapsule.