Microelectromechanical systems and system-on-chip connectivity

Abstract

The interconnection of microelectromechanical systems (MEMS) and other devices to a system-on-chip (SoC) implementation is described. MEMS technology can be used to fabricate both application specific devices and the associated micropackaging system that will allow for the integration of devices or circuits, made with non-compatible technologies, with a SoC environment. In the primary example presented, MEMS technology has been used to develop an acoustical array sensor for a hearing instrument application and also to provide a custom micropackaging solution suitable for in-the-ear canal implantation. A MEMS based modular micropackaging solution consisting of MEMS socket submodules and an insertable/removable microbus card has been developed to provide the necessary packaging and connectivity requirements. The modular socket concept can also be used for many other purposes, such as temporarily connecting a CMOS die to a SoC implementation of a die tester using MEMS based cantilevered bridge-type microspring contacts to provide connectivity to the die under test.