Abstract

The trend of the ever-continuing miniaturization requires fast and flexible processing tools. Lasers are flexible tools which have proven their reliability in manufacturing of macrofeatures for many years already. However, to process small features the requirements of the laser source, e.g. in regard to the beam profile, are very high. Innovative laser sources which meet these requirements, such as diode-pumped solid-state lasers, and the progress in processing technology, have made microfeature processing commercially viable during recent years. Examples of industrial applications are laser-drilled micro-injection nozzles for highly efficient automobile engines or manufacturing of complex spinnerets for production of synthetic fibers. The unique advantages of laser-based techniques stem from their ability to produce high-aspect-ratio holes, while yielding small heat-affected zones with exceptional surface quality, roundness and taper tolerances. Additionally, the ability to drill blind holes and slots in very hard materials such as diamond, silicon, sapphire, ceramics and steel is of great interest for many applications in the microelectronics, semiconductor and automotive industries. This kind of high-quality, high-aspect-ratio micromachining requires high peak powers and short pulse durations.

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