Abstract
The compact chip carrier named MCC has been developed for high density chip level packaging. The MCC realizes the smallest possible hermetic chip package by introducing full surface flip-chip interconnections, thin-film process technology, built-in termination resistors, and a thermal expansion matched ceramic substrate. The structure of the MCC and the thin-film process technology for its fabrication are reported.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
