Abstract
MAPbI3 thin films were grown via 2-step vacuum based processes by depositing methyl ammonium iodide (MAI) layer as first step using plasma enhanced chemical vapour deposition (PECVD) technique and then depositing lead iodide (PbI2) layer over it as second step using RF-sputtering technique. To the best of our knowledge MAI layer was deposited for the first time by PECVD technique. MAI solution for PECVD process and PbI2 target for sputtering process were made to deposit these two layers under optimized plasma conditions for the growth of MAPbI3 thin films. Characterization techniques like UV-Vis-NIR spectroscopy and Photoluminescence spectroscopy were performed to study the optical properties. Powder-XRD (PXRD) and glancing incidence XRD (GIXRD) were performed to study structural properties. SEM and cross-SEM were performed for morphological study to view top-view and cross-sectional view of the deposited MAPbI3 perovskite thin film. Perovskite thin films deposited on silicon wafer have been used as perovskite/silicon heterojunction photodiode exhibiting critical performance parameters such as rectifying ratio of 1.58 × 104 at 1.0 V, photo-sensitivity value 7.46 × 102 at light intensity 100 mw/cm2 without biasing.
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