Abstract
In the present work, lead free methyl ammonium tin iodide (CH3NH3SnI3 or MASnI3) perovskite thin films have been deposited via single step plasma enhanced chemical vapour deposition (PECVD) technique. In our earlier work, we reported lead based methyl ammonium lead iodide (CH3NH3PbI3 or MAPbI3) perovskite thin film deposition in 2-step, using sputtering technique for the PbI2 thin films and PECVD technique for CH3NH3I (MAI) thin films. Similarly, CH3NH3SnI3 perovskite thin films are deposited in this work using PECVD technique in single step. Lead is substituted with tin due to its toxic behaviour, environmental and health related issues. CH3NH3SnI3 perovskite is doped n-type via changing the molar ratio of SnI2 and CH3NH3I. SnI2/CH3NH3I ratio is changed from 0.33 to 2 to study the n-type doping of CH3NH3SnI3 perovskite. Deposited CH3NH3SnI3 perovskite thin films are deposited over p-type silicon wafer to make n-type doped n-CH3NH3SnI3/p-Si heterojunction photodiode.
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