Abstract
To investigate the recycle possibility of a slurry for the oxide chemical-mechanical polishing (oxide-CMP) applications, we introduce three kinds of re-treated methods. First, the effects of addition of silica abrasives and a diluted silica slurry (DSS) on CMP performance were investigated. Second, the characteristics of a mixed abrasive slurry (MAS) using non-annealed and annealed alumina (Al2O3) powder as an abrasive added within a DSS were evaluated to achieve improved removal rates (RRs) and to decrease within-wafer non-uniformity percent (WIWNU%). Third, the oxide-CMP wastewater was examined in order to evaluate possible ways of reusing it. We discuss the CMP characteristics of a silica slurry re-treated by mixing of an original slurry with a used slurry (MOS). As an experimental result, the possibility of using a recycled slurry for oxide-CMP was confirmed. Our proposed methods will contribute to substantial savings in slurry consumption. Furthermore, acceptable oxide-CMP characteristics can be achieved by using a two-step CMP procedure.
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