Abstract
Chemical-mechanical polishing (CMP) characteristics of mixed abrasive slurry (MAS) were studied which was retreated by adding of Ceria (CeO2) abrasives within 1:10 diluted silica slurry (DSS). The slurry was designed for optimal performance which produces reasonable removal rate, acceptable polishing selectivity with respect to underlying layer, low surface defects after polishing, and good slurry stability. The modified abrasives in MAS are evaluated with respect to their particle size distribution, surface morphology, and CMP performances such as removal rate and non-uniformity. As an experimental result, we could obtain successful slurry characteristics compared with traditional silica slurry in the viewpoint of removal rate and non-uniformity.
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