Abstract
Technique of modification of basal faces Pt(hkl) by adatoms and epitaxial copper deposits is developed. Analysis of potentiostatic current transients of copper deposition/dissolution and atomic force microscopy showed that the activity of Pt(hkl) faces regarding the processes of copper nucleation and epitaxial growth increases in the sequence of Pt(111) < Pt(110) < Pt(100). The reaction of nitrate anion reduction is sensitive towards the surface structure, not only in the case of platinum, but also in the case of copper deposits (including a monolayer of adatoms). The highest process rate is observed for the Pt(100) electrode modified by a monolayer of adatoms or islands of bulk copper; nitrate reduction at the lowest rate occurs at Pt(111) + Cu electrodes. Structure-sensitive competitive adsorption of background electrolyte and nitrate anions is the factor that largely determines the kinetics of nitrate reduction on different faces of platinum single crystal and copper deposits.
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