Abstract

Comparative analysis of copper nanoparticles (CuNPs) obtained by electrodeposition on highly oriented pyrolytic graphite (HOPG) substrates from different supporting electrolytes containing sulphate anions, was performed. Voltammetric results indicated that Cu electrodeposition follows a diffusion-controlled nucleation and crystal growth model for three solutions studied (Na2SO4, H2SO4 and Na2SO4+H2SO4). Na2SO4 solution was found to be most effective because the copper reduction occurs at most positive potential value, reaching the highest current density. Analysis of potentiostatic current transients revealed that the process can be described predominantly by a model involving 3D-progressive nucleation mechanism, which was corroborated by scanning electron microscopy (SEM) analysis. SEM images showed high density of hemispherical shaped Cu particles of different sizes (mostly between 80-150 nm), randomly distributed on the HOPG surface for Na2SO4 electrolyte solution. In the presence of H2SO4, the size dispersion decreased, resulting in particles with greater diameters (up to 339 nm). The use of electrolyte solution with Na2SO4+H2SO4 revealed lower particle density with a considerable crystal size dispersion, where very small crystallites are prevailing. Cyclic voltammetry was used to evaluate qualitatively the catalytic activity of CuNPs deposited from three electrolyte solutions towards the nitrate reduction reaction. An enhanced catalytic effect was obtained when copper particles were prepared from either Na2SO4 or H2SO4 supporting electrolytes.

Highlights

  • A comparative analysis of the initial stages of copper electrodeposition on highly oriented pyrolytic graphite (HOPG) from different supporting electrolytes containing SO42- anions (Na2SO4, H2SO4 and Na2SO4+ H2SO4) has been carried out to increase the understanding of the nucleation and growth of copper particles and their electrocatalytic properties

  • A single cathodic peak is evidenced as a result of the Cu2+ electroreduction process, and it is accepted that it occurs on a global stage via 2 electrons

  • It is well known that in an acid medium [24,25] or in the presence of complexing anions such as chloride [26], the electrodeposition of Cu can be considered to occur in two consecutive stages with the formation of Cu+ ions as intermediate species

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Summary

Introduction

A comparative analysis of the initial stages of copper electrodeposition on HOPG from different supporting electrolytes containing SO42- anions (Na2SO4, H2SO4 and Na2SO4+ H2SO4) has been carried out to increase the understanding of the nucleation and growth of copper particles and their electrocatalytic properties. Cyclic voltammograms of HOPG electrode immersed in blank solutions (without containing Cu(II) ions) shown in the inset of Figure 1, indicate that the hydrogen evolution reaction occurs at more negative potential values and does not interfere with the Cu electrodeposition process under the conditions considered in this study.

Results
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